JPS601968A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS601968A
JPS601968A JP58109531A JP10953183A JPS601968A JP S601968 A JPS601968 A JP S601968A JP 58109531 A JP58109531 A JP 58109531A JP 10953183 A JP10953183 A JP 10953183A JP S601968 A JPS601968 A JP S601968A
Authority
JP
Japan
Prior art keywords
semiconductor element
projected electrode
conductor lead
conductive lead
protruding electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58109531A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469426B2 (en]
Inventor
Izumi Okamoto
岡本　泉
Masayoshi Mihata
御幡　正芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58109531A priority Critical patent/JPS601968A/ja
Publication of JPS601968A publication Critical patent/JPS601968A/ja
Publication of JPH0469426B2 publication Critical patent/JPH0469426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Collation Of Sheets And Webs (AREA)
  • Wire Bonding (AREA)
JP58109531A 1983-06-17 1983-06-17 半導体装置 Granted JPS601968A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58109531A JPS601968A (ja) 1983-06-17 1983-06-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58109531A JPS601968A (ja) 1983-06-17 1983-06-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS601968A true JPS601968A (ja) 1985-01-08
JPH0469426B2 JPH0469426B2 (en]) 1992-11-06

Family

ID=14512610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109531A Granted JPS601968A (ja) 1983-06-17 1983-06-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS601968A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0645806A4 (en) * 1993-04-08 1995-10-11 Seiko Epson Corp SEMICONDUCTOR DEVICE.
US6608368B2 (en) 1997-02-27 2003-08-19 Seiko Epson Corporation Semiconductor device with power source conductor pattern and grounding conductor pattern
US7157790B2 (en) * 2002-07-31 2007-01-02 Microchip Technology Inc. Single die stitch bonding
US7326594B2 (en) 2002-07-31 2008-02-05 Microchip Technology Incorporated Connecting a plurality of bond pads and/or inner leads with a single bond wire

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123074A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123074A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0645806A4 (en) * 1993-04-08 1995-10-11 Seiko Epson Corp SEMICONDUCTOR DEVICE.
US5563445A (en) * 1993-04-08 1996-10-08 Seiko Epson Corporation Semiconductor device
US6608368B2 (en) 1997-02-27 2003-08-19 Seiko Epson Corporation Semiconductor device with power source conductor pattern and grounding conductor pattern
US7157790B2 (en) * 2002-07-31 2007-01-02 Microchip Technology Inc. Single die stitch bonding
US7326594B2 (en) 2002-07-31 2008-02-05 Microchip Technology Incorporated Connecting a plurality of bond pads and/or inner leads with a single bond wire

Also Published As

Publication number Publication date
JPH0469426B2 (en]) 1992-11-06

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